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Wednesday, 29 July 2015

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Embedded system internships in fluegzeug technologies

FlugZueg Technologies Pvt Ltd is a Chennai based Aerospace company established in 2014 to design, develop and operate Unmanned Aerial Systems.Where we are building a platform that can process, store, and deliver massive amounts of high-resolution images.

 

Post date: 29-07-2015

 

Last date: 09-08-2015

 

Qualifications: b.E/B.Tech ECE/EEE/EIE

 

How to apply: interested candidates should apply online

 

Apply Now

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Sunday, 26 July 2015

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Recruitment of Examiner of Patents & Designs for CGPDTM

National Productivity Council invites applications from graduates for various post in patent office

Last date: 24-08-2015

Qualifications: B.E/B.tech

How to apply: Interested candidates should apply online

Apply online
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Friday, 24 July 2015

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Principal Electronics Engineer recruitment for electronics

The Principal Electronics Engineer will have a good relevant degree with a background in: -Analogue electronics -Good knowledge of mixed signal design and high frequency design -Excellent communication skills. -Analogue signal conditioning -Analogue demodulation techniques 
 
Last dtae: 28-07-2015
 
How to apply: apply online
 
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Rail Vikas Nigam Ltd. (RVNL) jobs for Site Engineer

Site Engineer (Civil, Electrical & Signals) job vacancies in Rail Vikas Nigam Limited (RVNL). The engagement of successful candidate will be on contract basis (and not on regular basis) only initially for a period of one year to be reviewed after one year based on the performance of the candidate and the progress of the project.This recruitment is based on GATE 2014 or 2015

Qualifications: B.E/B.Tech in civil,electrical,ECE

Last date: 02-08-2015

How to apply: Apply online
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Wednesday, 15 July 2015

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Haryana Power Utilities recruitment of assistant engineer electronics

Asst.Engineer Electronics / UDC (IT) Jobs opportunity Haryana Power Utilities

Asst.Engineer (Electronics ) / Post ID : 81
No. of Vacancies : 118 posts
HVPNL : 40 posts
UHBVNL : 27 posts
DHBVNL : 31 posts
HPGCL : 20 posts
Qualification : Full –Time Bachelor of Engineering Degree or equivalent Degree from a University duly recognized by Central Government or a State Government with a minimum 60% marks in respect of General category & other category candidates and 55% marks in respect of SC category candidates of Haryana domicile, in any one of the disciplines : Electrical / Electrical & Electronics Engineering Must have passed Hindi / Sanskrit up to matric standard

Asst.Engineer (Electronics) / Post ID : 85
No. of Vacancies : HPGCL : 07 posts
Qualification : Full - Time Bachelor of Engineering Degree or equivalent Degree from a University duly recognized by Central Government or a State Government with a minimum 60% marks in respect of General category & other category candidates and 55% marks in respect of SC category candidates of Haryana domicile, in any one of the following disciplines : Electronics / Electronics & Communication / Electronics & Telecommunication / Electronics & Electrical Communication Engineering. Must have passed Hindi / Sanskrit up to matric standard

Selection process :
Selection process shall consist of Written Test & Interview..The Written Test shall be held at Delhi and Chandigarh / Panchkula
Application Fee :
Asst.Engineers : General Category The Male candidates in Rs.1000/- and Female candidates in Rs.500/-.The SC/BC-A/BC-B/SBC/EBP(Gen)Category the Male candidates in Rs. 250/- and Female candidates in Rs. 125/-

Bank charges of 60/- shall be charged by SBI. Accordingly, the candidates will have to deposit prescribed application fees + bank charges of 60/-to SBI.

 

How to apply:

Interested Candidates can apply online from 18-07-2015 to 16-08-2015 by logging onto any of the HPUs
Important Dates :
Opening date of online submission of application  :   18-07-2015
Closing date of online submission of application  :    16-08-2015
Opening date for deposit of fee through Bank Challan : 21 -07-2015
Last date for deposit of fee through Bank Challan   :      19-08-2015

 

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Sunday, 5 July 2015

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IOCL recruitment for diploma ECE

Applications are invited from eligible Indian Nationals for the position in workmen category in Barauni Kanpur Pipeline (BKPL) and Paradip Haldia Barauni Pipeline (PHBPL) unit of Pipeline Division.

 

Post date: 05-07-2015

 

Last date: 03-08-2015


Engineering Assistant - Grade- IV(Mechanical) / 01 post
Qualification : 3 years Full-time Diploma in Mechanical/Automobile Engineering from Government recognized institute with minimum 55% marks. (Pass marks for SC category candidates for the post reserved for SC)
Pay Scale (in ) : Rs.11900/- - Rs. 32000/-
Engineering Assistant- Grade -IV (Operations) / 02 posts
Qualification : 3-years Full-time Diploma in Mechanical/ Automobile / Electrical / Electronics and Communication / Chemical / Electronics and telecommunication/ Electronics and Radio Communication/ Instrumentation and Control/ Instrumentation and Process Control Engineering from Government recognized institute with minimum 55% marks.
Pay Scale (in ) : Rs.11900/- - Rs. 32000/-
Technical Attendant -Grade -I / 02 posts
Qualification : Matric/Class 10th/Madhyama with ITI from Government recognized institute. Candidates should possess Provisional National Trade Certificate or National Trade Certificate issued by NCVT from Government recognized ITIs/institute in any one of the ITI disciplines
Pay Scale (in ) : Rs.10500/- - Rs. 24500 /-


Application Fee :
Application Fee (non-refundable) of Rs.100/- (Rupees One Hundred only) through Demand Draft in favour of Indian Oil Corporation Limited (Pipelines Division) payable at State Bank of India, Barauni Refinery Campus Branch, Barauni, Begusarai (Branch Code: 1502) should be enclosed along with application form. Any other mode of payment is not acceptable and application not accompanying the application fee will be rejected without any further reference to the applicant.

 

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Sunday, 28 June 2015

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Have you ever wondered how Micro Oven works?

In this 20th century we have also come up with a smart way for cooking.
Today the most important thing in your kitchen,Canteen,Office is a microwave oven.Without this it is not possible to get a hot cake,a cup of tea or coffee and even a fresh cake within minutes.
Microwave oven was invented by Percy Spencer after the second world war.It was just an accident,just like most of the inventions.

Functioning of a Micro Oven:
As the name indicates it uses microwave frequency for its operation of about 2.45 GHz.These waves have some important properties that makes them important for an oven.Microwaves of about 2.45 GHz are absorbed by water,fats,sugar & microwaves are not absorbed by most of the plastics,glass or ceramics.Metals pans don't work well in microwave ovens because microwaves get reflected by metals & that is why microwaves devices have metal walls.

A microwave oven have basically 3 components :-
a).Magnetron ---- is a vacuum tube that generates microwave energy from the power supply it receives.The amount of wave generation may be different according to type of oven and its power rating.
b).Waveguide ---- we can say that it is path for microwaves to reach upto the metal case from the magnetron where these are generated.A waveguide provides a lossless transmission of waves upto metal case.
c).Stirrer Fan ---- At the end of waveguide,a stirrer fan is installed which helps to distribute microwaves uniformly in every corner of oven.
If you know that when we touch a hot object,the heat we observe is actually due to kinetic energy of molecules of object.Faster the molecules will move,hotter it will be.Let we put a samosa in oven,the microwaves will be absorbed by it & microwave changes its electric and magnetic field about 2450000000 times per second ( a microwave is an electromagnetic wave & e.m. wave are basically electric and magnetic field oscillating perpendicularly to one another ).This change of field will force the molecules of samosa to vibrate back & forth at same rate and the kinetic energy of molecules will generate heat in samosa.
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Friday, 26 June 2015

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Introduction to Embedded C Programming

Have you ever wondered how does the electronic gadgets we use in our daily life works?

Almost all the electronic gadgets we come across in our daily lives are various types of embedded systems. Be it a digital camera or a mobile phone or a washing machine, all of them has some kind of processor functioning inside it. Combination of several processors is the embedded software. If hardware forms the body of an embedded system, embedded processor acts as the brain, and embedded software forms its soul. It is the embedded software which primarily governs the functioning of embedded systems.


C was developed by Kernighan and Ritchie to fit into the space of 8K and to write (portable) operating systems. Originally it was implemented on UNIX operating systems. As it was intended for operating systems development, it can manipulate memory addresses. Also, it allowed programmers to write very compact codes. This has given it the reputation as the language of choice for hackers too.

Embedded systems programming is different from developing applications on a desktop computers. Key characteristics of an embedded system, when compared to PCs, are as follows:

  •  Embedded devices have resource constraints(limited ROM, limited RAM, limited stack space, less processing power)
  • Components used in embedded system and PCs are different; embedded systems typically uses smaller, less power consuming components. Embedded systems are more tied to the hardware.

 Two salient features of Embedded Programming are code speed and code size. Code speed is governed by the processing power, timing constraints, whereas code size is governed by available program memory and use of programming language.  Goal of embedded system programming is to get maximum features in minimum space and minimum time.

Use of C in embedded systems is driven by following advantages

  • It is small and reasonably simpler to learn, understand, program and debug.
  •    C Compilers are available for almost all embedded devices in use today, and there is a large pool of experienced C programmers.
  •  Unlike assembly, C has advantage of processor-independence and is not specific to any particular microprocessor/ microcontroller or any system. This makes it convenient for a user to develop programs that can run on most of the systems.
  •    As C combines functionality of assembly language and features of high level languages, C is treated as a ‘middle-level computer language’ or ‘high level assembly language’
  •   It is fairly efficient
  •   It supports access to I/O and provides ease of management of large embedded projects.
What is the Difference between C & Embedded C?

  1. Though C and embedded C appear different and are used in different contexts, they have more similarities than the differences. Most of the constructs are same; the difference lies in their applications.
  2. C is used for desktop computers, while embedded C is for microcontroller based applications. Accordingly, C has the luxury to use resources of a desktop PC like memory, OS, etc. While programming on desktop systems, we need not bother about memory. However, embedded C has to use with the limited resources (RAM, ROM, I/Os) on an embedded processor. Thus, program code must fit into the available program memory. If code exceeds the limit, the system is likely to crash.
  3. Compilers for C (ANSI C) typically generate OS dependant executables. Embedded C requires compilers to create files to be downloaded to the microcontrollers/microprocessors where it needs to run. Embedded compilers give access to all resources which is not provided in compilers for desktop computer applications.
  4. Embedded systems often have the real-time constraints, which is usually not there with desktop computer applications.
  5. Embedded systems often do not have a console, which is available in case of desktop applications.
  6. So, what basically is different while programming with embedded C is the mindset; for embedded applications, we need to optimally use the resources, make the program code efficient, and satisfy real time constraints, if any. All this is done using the basic constructs, syntaxes, and function libraries of ‘C’.
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Know about VLSI Designing

Many advanced developments have taken place in the field of  microelectronics. Early 60’s saw the low density fabrication processes classified under Small Scale Integration (SSI) in which transistor count was limited to about 10. This rapidly gave way to Medium Scale Integration in the late 60’s when around 100 transistors could be placed on a single chip.Early seventies marked the growth of transistor count to about 1000 per chip called the Large Scale Integration. By mid eighties, the transistor count on a single chip had already exceeded 1000 and hence came the age of Very Large Scale Integration or VLSI.  Today many companies like Texas Instruments, Infineon, Alliance Semiconductors, Cadence, Synopsys, Celox Networks, Cisco, Micron Tech, National Semiconductors, ST Microelectronics, Qualcomm, Lucent, Mentor Graphics, Analog Devices, Intel, Philips, Motorola and many other firms have been established and are dedicated to the various fields in "VLSI" like Programmable Logic Devices, Hardware Descriptive Languages, Design tools, Embedded Systems etc.

VLSI Design:


VLSI chiefly comprises of Front End Design and Back End design these days. While front end design includes digital design using HDL, design verification through simulation and other verification techniques, the design from gates and design for testability, backend design comprises of CMOS library design and its characterization. It also covers the physical design and fault simulation.

While Simple logic gates might be considered as SSI devices and multiplexers and parity encoders as MSI, the world of VLSI is much more diverse. Generally, the entire design procedure follows a step by step approach in which each design step is followed by simulation before actually being put onto the hardware or moving on to the next step. The major design steps are different levels of abstractions of the device as a whole:

1.      Problem Specification:  It is more of a high level representation of the system. The major parameters considered at this level are performance, functionality, physical dimensions, fabrication technology and design techniques. It has to be a tradeoff between market requirements, the available technology and the economical viability of the design. The end specifications include the size, speed, power and functionality of the VLSI system.

2.      Architecture Definition: Basic specifications like Floating point units, which system to use, like RISC (Reduced Instruction Set Computer) or CISC (Complex Instruction Set Computer), number of ALU’s cache size etc.

3.      Functional Design: Defines the major functional units of the system and hence facilitates the identification of interconnect requirements between units, the physical and electrical specifications of each unit. A sort of block diagram is decided upon with the number of inputs, outputs and timing decided upon without any details of the internal structure.

4.      Logic Design: The actual logic is developed at this level. Boolean expressions, control flow, word width, register allocation etc. are developed and the outcome is called a Register Transfer Level (RTL) description. This part is implemented either with Hardware Descriptive Languages like VHDL and/or Verilog. Gate minimization techniques are employed to find the simplest, or rather the smallest most effective implementation of the logic.

5.      Circuit Design: While the logic design gives the simplified implementation of the logic,the realization of the circuit in the form of a netlist is done in this step. Gates, transistors and interconnects are put in place to make a netlist. This again is a software step and the outcome is checked via simulation.

6.      Physical Design: The conversion of the netlist into its geometrical representation is done in this step and the result is called a layout. This step follows some predefined fixed rules like the lambda rules which provide the exact details of the size, ratio and spacing between components. This step is further divided into sub-steps which are:

    6.1 Circuit Partitioning: Because of the huge number of transistors involved, it is not possible to handle the entire circuit all at once due to limitations on computational capabilities and memory requirements. Hence the whole circuit is broken down into blocks which are interconnected.
      6.2 Floor Planning and Placement: Choosing the best layout for each block from partitioning step and the overall chip, considering the interconnect area between the blocks, the exact positioning on the chip in order to minimize the area arrangement while meeting the performance constraints through iterative approach are the major design steps taken care of in this step.
     6.3 Routing: The quality of placement becomes evident only after this step is completed. Routing involves the completion of the interconnections between modules. This is completed in two steps. First connections are completed between blocks without taking into consideration the exact geometric details of each wire and pin. Then, a detailed routing step completes point to point connections between pins on the blocks.
    6.4 Layout Compaction: The smaller the chip size can get, the better it is. The compression of the layout from all directions to minimize the chip area thereby reducing wire lengths, signal delays and overall cost takes place in this design step.
    6.5 Extraction and Verification: The circuit is extracted from the layout for comparison with the original netlist, performance verification, and reliability verification and to check the correctness of the layout is done before the final step of packaging.

7.      Packaging: The chips are put together on a Printed Circuit Board or a Multi Chip Module to obtain the final finished product.

Initially, design can be done with three different methodologies which provide different levels of freedom of customization to the programmers. The design methods, in increasing order of customization support, which also means increased amount of overhead on the part of the programmer, are FPGA and PLDs, Standard Cell (Semi Custom) and Full Custom Design.

While FPGAs have inbuilt libraries and a board already built with interconnections and blocks already in place; Semi Custom design can allow the placement of blocks in user defined custom fashion with some independence, while most libraries are still available for program development. Full Custom Design adopts a start from scratch approach where the programmer is required to write the whole set of libraries and also has full control over the block development, placement and routing. This also is the same sequence from entry level designing to professional designing.
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Wednesday, 24 June 2015

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HLL life care jobs for ece

Management Trainees Jobs opportunity in HLL Lifecare Limited Lookout for fresh, young, bright and energetic professionals having excellent academic track record and who wish to build their career with HLL, for the position of ‘Management Trainees in the disciplines of Engineering, Marketing, Human Resources and Pharma

 

post date; 23-06-2015

 

Last date: 08-07-2015

 

Management Trainee (Engineering)

Qualification : BE / B.Tech (Full time course only) with minimum 60% aggregate marks in any of the following domains : Electrical/ Mechanical/ Chemical/ Electronics/ Biomedical/ Civil/ Industrial Engineering/ Instrumentation/ Bio-technology/ Electrical & Electronics/ Applied Electronics/ Electronics & Communication/ Rubber Technology/ Computer Science/ Information Technology

Note : Final Year Students : Candidates appearing for their Final Semester Examination and expecting their final results by 31st July, 2015 can also apply subject to passing the qualifying degree with 60% marks (average of all semesters) at the time of interview. Candidates failing to produce the Provisional Certificate and Mark Sheets in original at the time of interview shall not be considered.

 

Application Fee :  An application fee of Rs.500/- (plus applicable bank charges) is to be remitted through the Payment Gateway which is available after completing the ONLINE application form. Application fee once remitted will not be refunded under any circumstances. Candidates belonging to SC/ST/ PwD candidates are exempted from payment of application fee.

 

Selection :  The selection process will consist of Written Test and Interview. The tentative date of written test will be on Sunday, 02nd August 2015

Test Centre : Eligible candidates will be required to appear for objective type written test at any one of the centers at New Delhi, Kolkata, Mumbai, Chennai & Thiruvananthapuram

Training & Placement :  Candidates selected as Management Trainee will be placed on training for a period of One year in HLL or any of its subsidiary companies anywhere in India. On successful completion of training, the candidates shall be placed under probation in the Executive cadre in HLL or any of its subsidiary companies anywhere in India.

Service Bond : Selected candidates will be required to execute a bond for Rs.50,000/- agreeing to serve the Company for a minimum period of Two years.

 

How to apply

Interested and eligible candidates may apply Online only through HLL website.

Important Dates

Starting date of ONLINE submission of application  : 23rd June, 2015

Closing date of ONLINE submission of application : 08th July, 2015

Releasing of ONLINE Admit Card (Tentative) : From 22nd July, 2015

Date of written test (Tentative)  : 02nd August, 2015 (SUNDAY)

 

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